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The Film Frame Handler 1200
FH-1200 Film Mounted Strip Handler supports single to massively
parallel testing
The
Strip Handler 5000
SH -5000 Universal Strip / Leadframe Handler thermally conditions and tests your strips from -55C to +160C
The Mark Handler 3000
Handle all package types with one laser marker that can mark up to 1000 characters per second
The MCT Mark Handler 3000.
A laser marker offering incomparable
flexibility and speed
This customizable system offers a variety of options and configurations to meet the changing needs of the semiconductor industry. MCT’s advanced SmartTrak software suite ensures optimum quality, process and data control. Integrated, intelligent lasers from leading suppliers have a small footprint and can mark up to 1000 characters per second. One laser marker handles all package types (QFN, SOIC, BGA, CSP, TSSOP, QFP, etc) rather than requiring a unique marker for each strip marking application. Virtually jam free operation increases capacity and reduces number of systems and operators. Innovative Data Management software that can be integrated into customer existing MES/MIS.
Capabilities:
- Supports the integration of lasers from many third party laser providers, which have a small footprint and can mark up to 1000 characters per second
- High Throughput from end of mark to next start mark index times, ranging between 600 msec to 1.5 sec.
- Virtually jam free operation
- All Package Types (QFN, SOIC, BGA, CSP, TSSOP, QFP, etc) are handled by one laser marker instead of a unique marker for each strip marking application.
Options:
- Product Handling Stacked Magazines
- ESD Ionizers (Option)
- Ground Fault Monitoring (Option)
- Brushing Pre and Post Mark
- 2D Verification and Orientation Pre and Post Mark (Option)
- Vision 2D Bottom side available (Option)
- Cell Controller Embedded or External (Option)
MH-3000 Advantages
Dramatic throughput increases over our previous generation marker.
Increased laser utilization and capacity enabled by virtually jam-free operation; reduces number of systems and operators.
One laser handles all package types instead of a unique marker for each strip marking application.
Quick kit changeover from one package type to another (e.g. CSP to SOIC), including IO type, in less than 15 minutes.
System modularity allows customer to buy and configure only what is needed with the potential for future expansion.
Significant reduction in cost of ownership over conventional processes. Less floor space, and reduced spares requirements.
Industry-leading process and applications experience reduces lead-time to device qualification.