The MCT
Film Frame Handler FH-1200.
One machine. Multiple applications.

This ingenious MCT product offers nearly universal testing capabilities for film mounted strip handling. It works with semiconductor test devices including QFN, BGA, CSP and WLP to assure the highest first pass yields available by enabling  increases from 1% to 10%+ through precise contactor alignment and device positioning accuracy. Supported by a cutting-edge data management system and analysis software, FH-1200 includes Smart-Track and Smart-EM – your “Virtual Process Engineer” – to handle electronic strip mapping, process control and data management.

Capabilities:

• Highest first pass yields available through the vision alignment and intelligent 4-axis test chuck
• Supports single to massively parallel testing
• Supports Ethernet, GPIB and other customer tester interface methods
• Supports creation or update of existing strip map via SECS/GEM
• Windows-based GUI with touch screen
• Quick change device kits without mechanical alignment
• No mechanical conversion parts required for film rings of the same size
• Fast indexing time - ≤ 3.5 second
• High throughput to reduce the cost of ownership
• Sawing defect vision alignment auto compensation

FH-1200 Advantages

First pass yield increases from 1% to 10%+ through precise contractor alignment and device positioning accuracy

Throughput of over 1 million devices per day on one handler with massively parallel test

Virtually jam-free operation increases tester utilization, increases capacity and reduces the number of systems and resources required

Entire wafer sawn package types (QFN, CSP,BGQ, WLF and more) are handled by one machine instead of a unique handler for each application

Data management and analysis software integrated into your existing MES that pinpoints upstream assembly problems and provides downstream binning

Significant reduction in cost of ownership over conventional singlulated processes, fewer handler-tester combinations, less floor space and reduced spares requirements

Industry-leading process and applications experience reduces lead time to device qualification

Quick kit change from one package size to another in less than 15 minutes. No mechanical changeover is needed with same diameter wafer ring carrier